FEATURED · TECHNOLOGY China Advanced Packaging Enters New Wave of Investment as 400 Billion Yuan in Projects Target Chiplet 3D Integration and AI Chip Substrates
July 29, 2026 1 min read 1
TECHNOLOGY

China Advanced Packaging Enters New Wave of Investment as 400 Billion Yuan in Projects Target Chiplet 3D Integration and AI Chip Substrates

Source: Pandaily

PUBLISHED
July 29, 2026
CATEGORY
Technology
PA
Pandaily
eChina Team
1

Nearly 10 advanced packaging projects totaling 400B yuan announced between May and July 2026, spanning 2.5D/3D, Chiplet, Fan-Out, and automotive chip packaging for AI and HPC.

2

Read the full article at the source →

Comments

İlk yorumu siz yazın!

Yorumunuzu yazın