Bernstein: Kirin 9050 Pro Multicore Tops A17 Pro as Huawei Narrows Mobile-Chip Gap Without EUV

Equity research firm Bernstein says Huawei's Kirin 9050 Pro, estimated at a 7nm-class node and built with LogicFolding under the Tau Scaling Law, beat Apple's 3nm A17 Pro in Geekbench 6 multicore and cut the mobile-chip gap to about three years—without EUV lithography.

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