Chinese RISC-V chipmaker Eswin seeks US$300m in Hong Kong IPO ahead of October debut

Revenue reached 2.4 billion yuan in 2025, up 20 per cent year on year, but net losses for the year stood at 1.5 billion yuan Beijing Eswin Computing Technology will start soliciting orders from institutional and public investors on Monday ahead of its Hong Kong initial public offering (IPO), aiming to raise around US$300 million, according to people familiar with the matter. The Chinese chipmaker had already started gauging investor interest, with trading expected to start on October 8, said one of the people, who asked not to be identified due to the sensitivity of the issue. The Beijing-headquartered company had earlier passed its listing hearing with bourse operator Hong Kong Exchanges and Clearing, clearing the final regulatory hurdle for a listing in the city. Citic Securities (Hong Kong) and China Securities (International) Corporate Finance Company are the joint sponsors.

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