AI chip boom shifts bottleneck to advanced packaging, says AT&S CEO

Austrian company expands Malaysia operations as AI demand outpaces substrate capacity Michael Mertin, chief executive of Austrian substrate supplier AT&S, says AI chips have increased the complexity of vendor-supplier relations. "You have to cooperate, you have to think, you have to have a joint roadmap." (Source photos by Norman Goh and AT&S Facebook page) PENANG, Malaysia — The global artificial intelligence boom is creating a new bottleneck in semiconductor manufacturing as demand for advanced chip packaging services and substrates outstrips supply, according to Austrian supplier AT&S.

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