FEATURED · TECHNOLOGY CSC Financial: AI-Driven PCB Demand Upgrade Accelerates High-End Dry Film Photoresist Localization as Market Approaches 13.6B RMB by 2030
July 20, 2026 1 min read 1
TECHNOLOGY

CSC Financial: AI-Driven PCB Demand Upgrade Accelerates High-End Dry Film Photoresist Localization as Market Approaches 13.6B RMB by 2030

Source: Pandaily

PUBLISHED
July 20, 2026
CATEGORY
PA
Pandaily
eChina Team
1

CSC Financial research forecasts global AI-server-driven PCB upgrade cycle pushing dry film photoresist market to 13.6B RMB by 2030 at 9.4% CAGR as Chinese suppliers lead localization.

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